Bii o ṣe le Yan Ipari Ilẹ fun Apẹrẹ PCB Rẹ
Ⅱ Igbelewọn ati Ifiwera
Ti a fiweranṣẹ: Oṣu kọkanla ọjọ 16, ọdun 2022
Awọn ẹka: Awọn bulọọgi
Awọn afi: pcb,pcba,pcb ijọ,pcb iṣelọpọ, pcb dada ipari
Awọn imọran pupọ lo wa nipa ipari dada, gẹgẹbi HASL ti ko ni idari ni iṣoro lati ni filati deede.Electrolytic Ni/Au jẹ gbowolori gaan ati pe ti o ba fi goolu pupọ ju lori paadi, o le ja si awọn isẹpo solder brittle.Immersion Tinah ni o ni solderability ibaje lẹhin ifihan si ọpọ ooru waye, bi ni a oke ati isalẹ ẹgbẹ PCBA reflow ilana, bbl .. Awọn iyato ti awọn loke dada pari nilo lati wa ni kedere mọ.Tabili ti o wa ni isalẹ fihan igbelewọn inira fun awọn ipari dada ti a lo nigbagbogbo ti awọn igbimọ Circuit ti a tẹjade.
Table1 Apejuwe ni ṣoki ti ilana iṣelọpọ, awọn anfani ati awọn konsi pataki, ati awọn ohun elo aṣoju ti awọn ipari dada ti ko ni idari olokiki ti PCB
| PCB dada Ipari | Ilana | Sisanra | Awọn anfani | Awọn alailanfani | Awọn ohun elo Aṣoju |
| HASL laisi asiwaju | PCB lọọgan ti wa ni immersed ni didà Tin iwẹ ati ki o si ti a fẹ nipa gbona air obe fun alapin pats ati excess solder yiyọ. | 30µin(1µm) -1500µin(40µm) | Ti o dara Solderability;Ti o wa ni ibigbogbo;Le ṣe atunṣe / tunṣe;Long selifu gun | Awọn ipele ti kii ṣe deede;mọnamọna gbona;Ririnrin ti ko dara;Solder Afara;Awọn PTH ti a somọ. | O wulo pupọ;Dara fun awọn paadi nla ati aye;Ko dara fun HDI pẹlu <20 mil (0.5mm) ipolowo ti o dara ati BGA;Ko dara fun PTH;Ko baamu fun PCB Ejò ti o nipọn;Ni deede, ohun elo: Awọn igbimọ Circuit fun idanwo itanna, titaja ọwọ, diẹ ninu awọn ẹrọ itanna ti o ga julọ gẹgẹbi aaye afẹfẹ ati awọn ẹrọ ologun. |
| OSP | Kemikali lilo ohun Organic yellow si awọn lọọgan dada lara ohun Organic ti fadaka Layer lati dabobo fara Ejò lati ipata. | 46µni (1.15µm) -52µin(1.3µm) | Owo pooku;Awọn paadi jẹ aṣọ ati alapin;Ti o dara solderability;Le jẹ ẹyọkan pẹlu awọn ipari dada miiran;Ilana jẹ rọrun;Le ṣe atunṣe (inu idanileko). | Ifarabalẹ si mimu;Igbesi aye selifu kukuru.Gan lopin solder ntan;Ibajẹ solderability pẹlu iwọn otutu ti o ga & awọn iyipo;Alaiṣedeede;O soro lati ṣayẹwo, ICT iwadi, ionic & tẹ-fit ifiyesi | O wulo pupọ;Dara dara fun SMT / awọn ipolowo itanran / BGA / awọn paati kekere;Sin awọn igbimọ;Ko dara fun PTHs;Ko dara fun crimping ọna ẹrọ |
| ENIG | Ilana Kemikali eyiti o ṣe awopọ bàbà ti o farahan pẹlu Nickel ati Gold, nitorinaa o ni ipele ilọpo meji ti ibora ti fadaka. | 2µin (0.05µm) – 5µin (0.125µm) ti wura ju 120µin (3µm) – 240µin (6µm) ti Nickel | O tayọ solderability;Awọn paadi jẹ alapin ati aṣọ;Al waya bendability;Idaabobo olubasọrọ kekere;Igbesi aye selifu gigun;Ti o dara ipata resistance ati agbara | "Black paadi" ibakcdun;Pipadanu ifihan agbara fun awọn ohun elo iduroṣinṣin ifihan;ko le tun ṣiṣẹ | O tayọ fun Apejọ ti ipolowo ti o dara ati gbigbe gbigbe dada eka (BGA, QFP…);O tayọ fun ọpọ Soldering orisi;Ayanfẹ fun PTH, tẹ fit;Waya Bondable;Iṣeduro fun PCB pẹlu ohun elo igbẹkẹle giga gẹgẹbi afẹfẹ, ologun, iṣoogun ati awọn onibara ti o ga julọ, ati bẹbẹ lọ;Ko ṣe iṣeduro fun Awọn paadi Olubasọrọ Fọwọkan. |
| Electrolytic Ni/Au (Gold asọ) | 99.99% mimọ - 24 carat Gold ti a lo lori Layer nickel nipasẹ ilana itanna ṣaaju ki o to soldermask. | 99.99% goolu mimọ, 24 Karat 30µin (0.8µm) -50µin (1.3µm) ju 100µin (2.5µm) -200µin (5µm) ti nickel | Lile, dada ti o tọ;Iwa adaṣe nla;Fifẹ;Al waya bendability;Idaabobo olubasọrọ kekere;Igbesi aye selifu gigun | Gbowolori;Au embrittlement ti o ba ti ju nipọn;Awọn idiwọ ifilelẹ;Afikun processing / laala lile;Ko dara fun soldering;Aso ni ko aṣọ | Ti a lo ni akọkọ ni asopọ okun waya (Al & Au) ni package chirún gẹgẹbi COB (Chip on Board) |
| Electrolytic Ni/Au (Glu lile) | 98%. | 98% goolu mimọ, 23 Karat30µin (0.8µm) -50µin (1.3µm) ju 100µin (2.5µm) -150µin (4µm) ti Nickel | O tayọ solderability;Awọn paadi jẹ alapin ati aṣọ;Al waya bendability;Idaabobo olubasọrọ kekere;Atunse | Tarnish (mu ati ibi ipamọ) ipata ni agbegbe imi-ọjọ giga;Awọn aṣayan pq ipese ti o dinku lati ṣe atilẹyin ipari yii;Ferese iṣẹ kukuru laarin awọn ipele apejọ. | Ni akọkọ ti a lo fun isọdọkan itanna gẹgẹbi awọn asopọ eti (ika goolu), awọn igbimọ ti ngbe IC (PBGA/FCBGA/FCCSP...) , Awọn bọtini itẹwe, awọn olubasọrọ batiri ati diẹ ninu awọn paadi idanwo, ati bẹbẹ lọ. |
| Immersion Ag | A Silver Layer ti wa ni nile lori Ejò dada nipasẹ ohun electroless plating ilana lẹhin etch sugbon ki o to soldermask | 5µni(0.12µm) -20µin(0.5µm) | O tayọ solderability;Awọn paadi jẹ alapin ati aṣọ;Al waya bendability;Idaabobo olubasọrọ kekere;Atunse | Tarnish (mu ati ibi ipamọ) ipata ni agbegbe imi-ọjọ giga;Awọn aṣayan pq ipese ti o dinku lati ṣe atilẹyin ipari yii;Ferese iṣẹ kukuru laarin awọn ipele apejọ. | Yiyan ọrọ-aje si ENIG fun Awọn itọpa Fine ati BGA;Apẹrẹ fun ga iyara awọn ifihan agbara ohun elo;O dara fun awọn iyipada awọ-ara, idaabobo EMI, ati asopọ okun waya aluminiomu;Dara fun titẹ titẹ. |
| Immersion Sn | Ninu iwẹ kẹmika ti ko ni elekitiroti, Layer tinrin funfun ti Tin fi silẹ taara lori bàbà ti awọn igbimọ iyika bi idena fun yago fun ifoyina. | 25µin (0.7µm)-60µin(1.5µm) | Ti o dara julọ fun imọ-ẹrọ fit titẹ;Iye owo to munadoko;Planar;O tayọ solderability (nigbati alabapade) ati dede;Fifẹ | Solderability ibaje pẹlu pele temps & amupu;Tin ti a fi han lori apejọ ikẹhin le bajẹ;Mimu awọn oran;Tin Wisking;Ko dara fun PTH;Ti o ni Thiourea, Carcinogen ti a mọ. | Iṣeduro fun awọn iṣelọpọ iye nla;O dara fun aaye SMD, BGA;Ti o dara ju fun titẹ fit ati backplanes;Ko ṣe iṣeduro fun PTH, awọn iyipada olubasọrọ, ati lilo pẹlu awọn iboju iparada |
Table2 Igbelewọn ti awọn ohun-ini aṣoju ti Ipari Ilẹ PCB ode oni lori iṣelọpọ ati ohun elo
| Ṣiṣejade ti awọn ipari dada ti o wọpọ julọ | |||||||||
| Awọn ohun-ini | ENIG | ENEPIG | Asọ Gold | Wura lile | IAg | ISn | HASL | HASL- LF | OSP |
| Gbajumo | Ga | Kekere | Kekere | Kekere | Alabọde | Kekere | Kekere | Ga | Alabọde |
| Iye owo ilana | O ga (1.3x) | O ga (2.5x) | Ti o ga julọ (3.5x) | Ti o ga julọ (3.5x) | Alabọde (1.1x) | Alabọde (1.1x) | Kekere (1.0x) | Kekere (1.0x) | Ti o kere julọ (0.8x) |
| Idogo | Immersion | Immersion | Electrolytic | Electrolytic | Immersion | Immersion | Immersion | Immersion | Immersion |
| Igbesi aye selifu | Gigun | Gigun | Gigun | Gigun | Alabọde | Alabọde | Gigun | Gigun | Kukuru |
| RoHS ni ibamu | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | No | Bẹẹni | Bẹẹni |
| Dada Co-planarity fun SMT | O tayọ | O tayọ | O tayọ | O tayọ | O tayọ | O tayọ | Talaka | O dara | O tayọ |
| Ejò farasin | No | No | No | Bẹẹni | No | No | No | No | Bẹẹni |
| Mimu | Deede | Deede | Deede | Deede | Lominu ni | Lominu ni | Deede | Deede | Lominu ni |
| Ilana akitiyan | Alabọde | Alabọde | Ga | Ga | Alabọde | Alabọde | Alabọde | Alabọde | Kekere |
| Atunse Agbara | No | No | No | No | Bẹẹni | Ko daba | Bẹẹni | Bẹẹni | Bẹẹni |
| Ti a beere Gbona cycles | ọpọ | ọpọ | ọpọ | ọpọ | ọpọ | 2-3 | ọpọ | ọpọ | 2 |
| Oro whisker | No | No | No | No | No | Bẹẹni | No | No | No |
| Gbona mọnamọna (PCB MFG) | Kekere | Kekere | Kekere | Kekere | Irẹlẹ pupọ | Irẹlẹ pupọ | Ga | Ga | Irẹlẹ pupọ |
| Low Resistance / Ga iyara | No | No | No | No | Bẹẹni | No | No | No | N/A |
| Awọn ohun elo ti o wọpọ julọ lo dada pari | |||||||||
| Awọn ohun elo | ENIG | ENEPIG | Asọ Gold | wura lile | IAg | ISn | HASL | LF-HASL | OSP |
| Kosemi | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni |
| Flex | Ni ihamọ | Ni ihamọ | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni |
| Flex-kosemi | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Ko Ayanfẹ |
| Ifilelẹ ti o dara | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Ko Ayanfẹ | Ko Ayanfẹ | Bẹẹni |
| BGA & μBGA | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Ko Ayanfẹ | Ko Ayanfẹ | Bẹẹni |
| Multiple Solderability | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Ni ihamọ |
| Yipada Chip | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | No | No | Bẹẹni |
| Tẹ Fit | Ni ihamọ | Ni ihamọ | Ni ihamọ | Ni ihamọ | Bẹẹni | O tayọ | Bẹẹni | Bẹẹni | Ni ihamọ |
| Nipasẹ-Iho | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | Bẹẹni | No | No | No | No |
| Waya imora | Bẹẹni (Al) | Bẹẹni (Al, Au) | Bẹẹni (Al, Au) | Bẹẹni (Al) | Ayípadà (Al) | No | No | No | Bẹẹni (Al) |
| Solder Wettability | O dara | O dara | O dara | O dara | O dara pupọ | O dara | Talaka | Talaka | O dara |
| Solder Joint iyege | O dara | O dara | Talaka | Talaka | O tayọ | O dara | O dara | O dara | O dara |
Igbesi aye selifu jẹ nkan pataki ti o nilo lati ronu nigbati o ba n ṣe awọn iṣeto iṣelọpọ rẹ.Igbesi aye selifuni window isẹ ti o funni ni ipari lati ni weldability PCB pipe.O ṣe pataki lati rii daju pe gbogbo awọn PCB rẹ ti pejọ laarin igbesi aye selifu.Ni afikun si ohun elo ati ilana eyiti o jẹ ki o pari dada, igbesi aye selifu ti ipari ni ipa pupọnipasẹ PCBs apoti ati ibi ipamọ.Olubẹwẹ ti o muna ti ilana ibi ipamọ to tọ ti a daba nipasẹ awọn ilana IPC-1601 yoo ṣe itọju weldability ati igbẹkẹle ti pari.
Table3 Selifu aye lafiwe laarin Gbajumo dada pari ti PCB
|
| Aṣoju SHEL LIFE | Igbesi aye selifu ti a daba | Atunse Chance |
| HASL-LF | 12 osu | 12 osu | BẸẸNI |
| OSP | Osu 3 | Osu 1 | BẸẸNI |
| ENIG | 12 osu | 6 osu | RARA* |
| ENEPIG | 6 osu | 6 osu | RARA* |
| Electrolytic Ni/Au | 12 osu | 12 osu | NO |
| IAg | 6 osu | Osu 3 | BẸẸNI |
| ISn | 6 osu | Osu 3 | BẸẸNI *** |
* Fun ENIG ati ENEPIG ipari ọmọ isọdọtun lati mu ilọsiwaju wettability ati igbesi aye selifu wa.
** Atunse Tin Kemikali ko daba.
Padasi awọn bulọọgi
Akoko ifiweranṣẹ: Oṣu kọkanla-16-2022
